SAHAN GUNAWARDANA
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Distributed Architecture VLOAM Payload (V2)
Project Type
Robotics
Date
August 2022 - August 2023
Role
Systems Designer (Mechanical, Electronic, Software)
Project Contributions
-Designed payload using Autodesk Inventor to meet MIL-STD-810G testing standards for altitude, vibration, shock, thermal shock and humidity
-Designed, manufactured and tested a custom PCB integrating a Atmel 2560 microcontroller using Altium Designer.
-Sourced all electronics and sensors from numerous distributors
-Designed, manufactured and assembled a bench-test platform to validate function of all sensors
-Integrated an embedded camera, FLIR thermal camera, LiDAR, and an Echodyne radar onto the test platform as well as the payload (Mechanical, electrical and software integration)
-Created extensive design documentation for review by the NRC air-worthiness team
Payload Improvements
-Designed for use in harsh environmental and handling conditions
-Incorporates more sensors (Thermal, radar) to increase operational envelope (night, low visibility etc)
-Designed to be a "distributed architecture", meaning multiple odometry units can be connected via a central hub. This allows multiple units to be mounted around the aircraft to provide 360 degree coverage
This is the second iteration of the VLOAM flight payload designed using embedded variants of similar sensors with greater reliability and performance.
