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Distributed Architecture VLOAM Payload (V2)
Project Type
Robotics
Date
August 2022 - August 2023
Role
Systems Designer (Mechanical, Electronic, Software)
Project Contributions
-Designed payload using Autodesk Inventor to meet MIL-STD-810G testing standards for altitude, vibration, shock, thermal shock and humidity
-Designed, manufactured and tested a custom PCB integrating a Atmel 2560 microcontroller using Altium Designer.
-Sourced all electronics and sensors from numerous distributors
-Designed, manufactured and assembled a bench-test platform to validate function of all sensors
-Integrated an embedded camera, FLIR thermal camera, LiDAR, and an Echodyne radar onto the test platform as well as the payload (Mechanical, electrical and software integration)
-Created extensive design documentation for review by the NRC air-worthiness team
Payload Improvements
-Designed for use in harsh environmental and handling conditions
-Incorporates more sensors (Thermal, radar) to increase operational envelope (night, low visibility etc)
-Designed to be a "distributed architecture", meaning multiple odometry units can be connected via a central hub. This allows multiple units to be mounted around the aircraft to provide 360 degree coverage
Project Description:
This is the second iteration of the VLOAM flight payload designed using embedded variants of similar sensors with greater reliability and performance.


































